J-STD-002E: The Latest Standard for Solderability Tests - Download Now
J-STD-002: What is it and why is it important?
Introduction
Soldering is a process of joining two or more metal parts by melting and flowing a filler metal into the joint. Soldering is widely used in the electronics industry to assemble printed circuit boards (PCBs), connect wires, attach components, and repair defects. However, soldering is not always easy or reliable. Sometimes, the solder does not wet the metal surfaces properly, resulting in poor or incomplete joints. This can affect the electrical and mechanical performance of the soldered assembly, leading to failures or malfunctions.
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To ensure the quality and reliability of soldered connections, it is important to test the solderability of electronic components before soldering. Solderability is the ability of a metal surface to be wetted by molten solder. Solderability depends on various factors, such as the type and composition of the metal, the surface finish and cleanliness, the storage conditions, the solder alloy and flux used, and the soldering method and parameters.
One of the most widely used standards for testing the solderability of electronic components is J-STD-002. This standard prescribes test methods, defect definitions, acceptance criteria, and illustrations for assessing the solderability of electronic component leads, terminations, solid wires, stranded wires, lugs, and tabs. It also includes a test method for the resistance to dissolution/dewetting of metallization. This standard is intended for use by both suppliers and users of electronic components.
What is J-STD-002?
J-STD-002 is a joint standard developed by IPC (Association Connecting Electronics Industries), EIA (Electronic Components Industry Association), and JEDEC (Solid State Technology Association). It was first published in 1992 and has been revised several times since then. The latest revision is J-STD-002E, which was released in November 2017.
J-STD-002 covers four different test methods for testing the solderability of electronic components:
Test T: Solderability test for tinned components using a solder pot/bath
Test R: Solderability test for reflowed components using a hot plate or an oven
Test S: Solderability test for surface mount components using a stencil/screen, paste application tool, paste dispensing, test substrate, and reflow equipment
Test A1 and B1: Solderability test for lead-free components using a solder pot/bath
Each test method has its own apparatus, preparation, procedure, and evaluation steps. The evaluation involves inspecting the wetting of the solder on the component surface using magnification and comparing it with the accept/reject criteria given in the standard. The standard also provides illustrations of acceptable and unacceptable solder joints for different types of components.
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What are the benefits of J-STD-002?
J-STD-002 provides several benefits for both suppliers and users of electronic components:
It helps to ensure the quality It helps to ensure the quality and reliability of soldered assemblies by verifying the solderability of components before soldering.
It helps to reduce the risk of soldering defects, such as non-wetting, dewetting, bridging, voids, cracks, and cold joints.
It helps to improve the efficiency and productivity of the soldering process by reducing the need for rework, repair, or replacement of faulty components.
It helps to comply with the industry standards and customer requirements for soldered electrical and electronic assemblies.
What are the applications of J-STD-002?
J-STD-002 is applicable to a wide range of electronic components that are intended to be soldered to PCBs or other substrates. Some examples of these components are:
Through-hole components, such as resistors, capacitors, diodes, transistors, LEDs, switches, connectors, sockets, and headers
Surface mount components, such as chip resistors, chip capacitors, chip inductors, chip diodes, chip transistors, chip LEDs, chip fuses, chip beads, and chip packages
Wire and cable components, such as solid wires, stranded wires, lugs, and tabs
J-STD-002 is also applicable to lead-free components that are designed to be compatible with lead-free solder alloys and processes. Lead-free components have different metallization and surface finishes than leaded components and may require different test methods and criteria for solderability testing.
J-STD-002 test methods and criteria
In this section, we will briefly describe the four test methods and their criteria for testing the solderability of electronic components according to J-STD-002. For more details and specifications, please refer to the standard document itself.
Test T: Solderability test for tinned components
Test T is used to test the solderability of tinned components that have a tin or tin alloy coating on their leads or terminations. The test involves dipping the component into a molten solder pot or bath at a specified temperature and time and then inspecting the wetting of the solder on the component surface.
Apparatus, preparation, procedure, and evaluation
The apparatus required for Test T are:
A solder pot or bath that can maintain a constant temperature within 5C of the specified value
A thermometer or thermocouple that can measure the temperature of the solder pot or bath
A flux that is compatible with the solder alloy and the component metallization
A solder alloy that has a melting point below 260C and meets the requirements of J-STD-006
A wire brush or abrasive paper for cleaning the component leads or terminations
A magnifier or microscope for inspecting the wetting of the solder on the component surface
The preparation steps for Test T are:
Clean the component leads or terminations with a wire brush or abrasive paper to remove any oxide or contamination
Preheat the component to a temperature within 25C of the solder pot or bath temperature for at least 10 seconds
Dip the component leads or terminations into the flux for 2 seconds
Shake off any excess flux from the component
The procedure steps for Test T are:
Dip the component leads or terminations into the molten solder pot or bath at a depth of 1.5 mm to 2.5 mm for 5 seconds 0.5 second
Lift the component out of the solder pot or bath at a rate of 25 mm per second 5 mm per second
Cool the component in air for at least 10 seconds before inspection
The evaluation steps for Test T are:
Inspect the wetting of the solder on the component surface using a magnifier or microscope at 10x to 40x magnification
Compare the wetting with the accept/reject criteria given in Table 3-1 of J-STD-002E
The component is acceptable if it meets one of the following criteria:
The wetting angle is less than 90 on both sides of all leads or terminations
The wetting balance is greater than 75% on both sides of all leads or terminations
The wetting balance is greater than 50% on both sides of all leads or terminations and there is no evidence The wetting balance is greater than 50% on both sides of all leads or terminations and there is no evidence of dewetting, non-wetting, or corrosion
The component is unacceptable if it fails to meet any of the above criteria or if it shows any of the following defects:
Dewetting: The solder has receded from the component surface, leaving irregularly shaped mounds or beads
Non-wetting: The solder has not spread on the component surface, leaving exposed base metal
Corrosion: The component surface shows signs of oxidation, discoloration, pitting, or flaking
Test R: Solderability test for reflowed components
Test R is used to test the solderability of reflowed components that have been subjected to a simulated reflow soldering process. The test involves placing the component on a test substrate with solder paste, heating it in a hot plate or an oven, and then inspecting the wetting of the solder on the component surface.
Apparatus, preparation, procedure, and evaluation
The apparatus required for Test R are:
A test substrate that has a copper-clad laminate with a solder mask and a pattern of solderable pads that match the component footprint
A solder paste that is compatible with the solder alloy and the component metallization
A stencil/screen, paste application tool, or paste dispensing equipment for applying the solder paste to the test substrate
A hot plate or an oven that can provide a controlled temperature profile for reflowing the solder paste
A magnifier or microscope for inspecting the wetting of the solder on the component surface
The preparation steps for Test R are:
Clean the test substrate with isopropyl alcohol or another suitable solvent to remove any contamination
Apply a thin and uniform layer of solder paste to the test substrate using a stencil/screen, paste application tool, or paste dispensing equipment
Align and place the component on the test substrate with its leads or terminations in contact with the solder paste
The procedure steps for Test R are:
Heat the test substrate with the component in a hot plate or an oven following a specified temperature profile that simulates a reflow soldering process
Cool the test substrate with the component in air for at least 10 seconds before inspection
The evaluation steps for Test R are:
Inspect the wetting of the solder on the component surface using a magnifier or microscope at 10x to 40x magnification
Compare the wetting with the accept/reject criteria given in Table 3-2 of J-STD-002E
The component is acceptable if it meets one of the following criteria:
The wetting angle is less than 90 on both sides of all leads or terminations
The wetting balance is greater than 75% on both sides of all leads or terminations
The wetting balance is greater than 50% on both sides of all leads or terminations and there is no evidence The wetting balance is greater than 50% on both sides of all leads or terminations and there is no evidence of dewetting, non-wetting, or corrosion
The component is unacceptable if it fails to meet any of the above criteria or if it shows any of the following defects:
Dewetting: The solder has receded from the component surface, leaving irregularly shaped mounds or beads
Non-wetting: The solder has not spread on the component surface, leaving exposed base metal
Corrosion: The component surface shows signs of oxidation, discoloration, pitting, or flaking
Test S: Solderability test for surface mount components
Test S is used to test the solderability of surface mount components that have leads or terminations on the bottom side of the component body. The test involves placing the component on a test substrate with solder paste, heating it in a reflow equipment, and then inspecting the wetting of the solder on the component surface.
Apparatus, preparation, procedure, and evaluation
The apparatus required for Test S are:
A test substrate that has a copper-clad laminate with a solder mask and a pattern of solderable pads that match the component footprint
A solder paste that is compatible with the solder alloy and the component metallization
A stencil/screen, paste application tool, or paste dispensing equipment for applying the solder paste to the test substrate
A reflow equipment that can provide a controlled temperature profile for reflowing the solder paste
A magnifier or microscope for inspecting the wetting of the solder on the component surface
The preparation steps for Test S are:
Clean the test substrate with isopropyl alcohol or another suitable solvent to remove any contamination
Apply a thin and uniform layer of solder paste to the test substrate using a stencil/screen, paste application tool, or paste dispensing equipment
Align and place the component on the test substrate with its leads or terminations in contact with the solder paste
The procedure steps for Test S are:
Heat the test substrate with the component in a reflow equipment following a specified temperature profile that simulates a reflow soldering process
Cool the test substrate with the component in air for at least 10 seconds before inspection
The evaluation steps for Test S are:
Inspect the wetting of the solder on the component surface using a magnifier or microscope at 10x to 40x magnification
Compare the wetting with the accept/reject criteria given in Table 3-3 of J-STD-002E
The component is acceptable if it meets one of the following criteria:
The wetting angle is less than 90 on both sides of all leads or terminations
The wetting balance is greater than 75% on both sides of all leads or terminations
The wetting balance is greater than 50% on both sides of all leads or terminations and there is no evidence The wetting balance is greater than 50% on both sides of all leads or terminations and there is no evidence of dewetting, non-wetting, or corrosion
The component is unacceptable if it fails to meet any of the above criteria or if it shows any of the following defects:
Dewetting: The solder has receded from the component surface, leaving irregularly shaped mounds or beads
Non-wetting: The solder has not spread on the component surface, leaving exposed base metal
Corrosion: The component surface shows signs of oxidation, discoloration, pitting, or flaking
Test A1 and B1: Solderability test for lead-free components
Test A1 and B1 are used to test the solderability of lead-free components that have a lead-free metallization or surface finish on their leads or terminations. The test involves dipping the component into a molten lead-free solder pot or bath at a specified temperature and time and then inspecting the wetting of the solder on the component surface.
Apparatus, preparation, procedure, and evaluation
The apparatus required for Test A1 and B1 are:
A solder pot or bath that can maintain a constant temperature within 5C of the specified value
A thermometer or thermocouple that can measure the temperature of the solder pot or bath
A flux that is compatible with the lead-free solder alloy and the component metallization
A lead-free solder alloy that meets the requirements of J-STD-006
A wire brush or abrasive paper for cleaning the component leads or terminations
A magnifier or microscope for inspecting the wetting of the solder on the component surface
The preparation steps for Test A1 and B1 are:
Clean the component leads or terminations with a wire brush or abrasive paper to remove any oxide or contamination
Preheat the component to a temperature within 25C of the solder pot or bath temperature for at least 10 seconds
Dip the component leads or terminations into the flux for 2 seconds
Shake off any excess flux from the component
The procedure steps for Test A1 and B1 are:
Dip the component leads or terminations into the molten lead-free solder pot or bath at a depth of 1.5 mm to 2.5 mm for 5 seconds 0.5 second (Test A1) or 10 seconds 0.5 second (Test B1)
Lift the component out of the solder pot or bath at a rate of 25 mm per second 5 mm per second
Cool the component in air for at least 10 seconds before inspection
The evaluation steps for Test A1 and B1 are:
Inspect the wetting of the solder on the component surface using a magnifier or microscope at 10x to 40x magnification
Compare the wetting with the accept/reject criteria given in Table 3-4 of J-STD-002E
The component is acceptable if it meets one of the following criteria:
The wetting angle is less than 90 on both sides of all leads or terminations
The wetting balance is greater than 75% on both sides of all leads or terminations
The wetting balance is greater than 50% on both sides of all leads or terminations and there is no evidence The wetting balance is greater than 50% on both sides of all leads or terminations and there is no evidence of dewetting, non-wetting, or corrosion
The component is unacceptable if it fails to meet any of the above criteria or if it shows any of the following defects:
Dewetting: The solder has receded from the component surface, leaving irregularly shaped mounds or beads
Non-wetting: The solder has not spread on the component surface, leaving exposed base metal
Corrosion: The component surface shows signs of oxidation, discoloration, pitting, or flaking
J-STD-002 comparison with other standards
J-STD-002 is not the only standard for testing the solderability of electronic components. There are other standards that have similar or different test methods and criteria for solderability testing. Some of these standards are:
J-STD-001: Requirements for soldered electrical and electronic assemblies
J-STD-001 is a joint standard developed by IPC and EIA. It specifies the materials, methods, and verification criteria for producing high-quality soldered interconnections. It covers various aspects of soldering, such as soldering materials, tools, equipment, processes, inspection, and cleanliness. It also includes a section on solderability testing for components and printed boards. However, J-STD-001 does not provide detailed test methods and criteria for solderability testing. Instead, it refers to J-STD-002 or other applicable standards for solderability testing.
JESD22-B102: Solderability test method for lead-free components
JESD22-B102 is a standard developed by JEDEC. It specifies a test method for evaluating the solderability of lead-free components using a lead-free solder alloy. It covers both through-hole and surface mount components. It uses a similar test method as Test A1 and B1 of J-STD-002, but with different test parameters and criteria. For example, JESD22-B102 uses a higher solder pot or bath temperature (260C 5C) and a longer dipping time (10 seconds 0.5 second) than J-STD-00
